Printed Circuit Board Design (PCB) Interview Questions & Answers

  1. Question 1. What Is Need For A Pcb?

    Answer :

    Designs on bread boards or per boards are cumbersome, to have neat placement of components without jumpers or wires a PCB is designed. It also helps in providing physical stability and overall circuit is more reliable.

  2. Question 2. How Do You Verify Schematic Symbols Or Footprints?

    Answer :

    Cross verify with datasheets, print footprints and match with actual devices before production.

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  4. Question 3. What Are Basic Checks While Laying Out Mcu Based Design?

    Answer :

    Power path: Ensure that the power flow tracks have sufficient trace width.

    Oscillator circuit: Ensure oscillator is placed near to MCU pins. Distance depends on specific MCU. It is done so that MCU receives stable oscillations without noise.

  5. Question 4. What Are Basic Checks For Rf Design?(or)
    What Are Units For Measuring Footprints?

    Answer :

    Millimeter: SMD components.

    Mils:Through hole.

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  7. Question 5. What Is Mil?

    Answer :

    1 mil is 1/1000 inch.

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  9. Question 6. Why Is It Used?

    Answer :

    The dimensions of most of the through hole components are in mils. e.g pitch between IC pins(100 mils), Width of ICs (300 mil, 600 mil) etc. Hence if measurement of these in mm will not round figures.

  10. Question 7. Flow Of Complete Pcb Design?

    Answer :

    • Library creation
    • Board outline and mechanicals
    • Importing net list
    • Design Rule settings
    • Component Placement
    •  Rounting
    •  Split plans
    •  Silkscreen and Assembly settings
    • Gerber Settings
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  12. Question 8. What Are The Inputs You Need To Design A Pcb?

    Answer :

    • We need schematic, bom and net list(some pcb engineer generates net list) from Hardware side and Board mechanicals from client i.e, board outline, mounting holes etc.
    • And another important thing that we need is PCB stackup it is based on complexity of the board for example if we are using fpga first we should know number of signal layers need for fpga signal breakout.
  13. Question 9. How To Create Footprint?

    Answer :

    Footprint flow:

    • Pad stack creation
    • pin placement
    • Assembly outline
    • Silkscreen outline
    • Place bound top (we can mention height of the here)
    • Dfa bound top
    • No probe top
    • Silk and assembly reference designator

    These are the basic things we need to create a footprint, follow IPC standards for proper guidelines.

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  15. Question 10. What Is Board Mechanicals?

    Answer :

    Draw board outline by considering client requirements, place mechanical holes and global fiducials.create route Keepin and place keepin areas,

    That can be raised from this

    • Size of the mechanical holes that you have used in your design and clearances that you have given to these.
    • What are fiducial and use of these fiducial and types and differences between them.
    • Fiducial placement and clearances.
    • What are the clearances you have given from board outline to route and place Keepin.
  16. Question 11. What Are The Errors You Got While Importing Net List ?

    Answer :

    PCB footprint not found. Pins mismatch between symbol and footprint etc.

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  18. Question 12. How Do Place Components?

    Answer :

    Place major components first i.e connectors, BGAs,mejor ICs then place other sections.

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  20. Question 13. Show Do You Place Connectors?

    Answer :

    First check whether i.e right angle or straight. If it is right angle place at edge of the board and consider if there any recommendations from client.

  21. Question 14. How Do You Plan Routing And What Are The Parameters You Consider While Routing ?

    Answer :

    Placement routing plays major roles in pcb design, quality of the board depends on placement and routing, good placement and routing can reduce your board fabrication cost also.

    Place components by considering routing strategy and follow schematic flow once your placement is done do fanout for all the components, route high speed interfaces and complex areas first and maintain ground reference plane for all high speed signals and make sure that every trace has reference plane and try to reduce vias on signals vias can change trace characteristic impedance.